(1) Choose imported high-precision materials (temperature sensor, PLC, heater) to control BGA desoldering & soldering procedures precisely.
(2) Top & bottom temperature areas heat independently, And it can set up 8 rising temperature segments and 8 constant temperature segments to control. It can save 10 groups of temperature curves at the same time.
(3) Choose imported high-precision thermocouple to detect the top/bottom temperature precisely.
(4) Top & bottom heating can be controlled independently by the temperature graphs. A cross-flow fan cools rapidly to protect the PCB from deformation when welding.
(5) This machine can be connected to a computer to be controlled more conveniently with a built-in PC serial port and a proprietary software attached to it.
(6) After finishing desoldering & soldering, there is an alarming. The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering.
(7) For large thermal capacity of PCB or other high-temperature and lead-free welding requirements, all can be handled easily.